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The Difference Between COB and GOB

Author:BelightRelease Date:2024-11-05Number of visitors:140

COB and GOB are both commonly used packaging methods in LED displays. Their main difference lies in the form of LED chip packaging. Here are their specific differences:


1. COB (Chip on Board)

 

COB packaging refers to the way weld the LED lamps directly onto the PCB substrate to make electrical connections. The main purpose of its introduction is to solve the heat dissipation problem of LED displays. COB is a new type of packaging technology, mainly used in some small-pitch products.It also have the advantages of high brightness, low energy consumption, long life and good uniformity.

COB packaging has been widely used in some application scenarios due to its low cost and high integration, such as display screens, car lights, signal lights, etc.

 

 

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2. GOB (Glass on Board)
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GOB packaging is a kind of packaging that uses advanced transparent materials to package PCB substrates and LED packaging units in order to solve the protection problem of LED displays. It is to add a layer of protection in front of the original LED module to achieve high protection functions, such as waterproof, moisture-proof, anti-impact, anti-bump, anti-static, anti-salt spray, anti-oxidation, anti-blue light, anti-vibration, etc. effect. The GOB packaging method has the advantages of small light leakage effect, good heat dissipation, and high color purity. The GOB packaging method is especially popular in large-size TV walls and smart projections that require high color consistency.

 

 

 

The main difference between COB and GOB is the production  process. Although the COB package has a flat surface and better protection than the traditional SMD package, the GOB package adds a glue filling process on the surface of the screen, making its LED lamp beads more stable. Greatly reduces the possibility of the light falling out, making it more stable.

 

There is no standard for which one is better between COB or GOB, because there are many factors that determine whether a packaging process is good or not. The key is which point we focus on, is its efficiency of the LED lamp or its protection? So, each packaging technology has its advantages and cannot be generalized. Therefore, when making the actual choice, whether to use COB or GOB packaging should be considered based on comprehensive factors such as the installation environment and working time, and this is also related to cost control and differences in display effects.


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