Date: 7th- 9thMar. 2025 Venue: Shenzhen Wold Exhibiton&Convention Center(Shenzhen World)Add: No. 1 Zhancheng Road, Fuhai Street, Bao’an District, Shenzhen, ChinaSupporter:LED Display Application Branch of
COB and GOB are both commonly used packaging methods in LED displays. Their main difference lies in the form of LED chip packaging. Here are their specific differences:1. COB (Chip on Board)COB packaging refers to the way weld the LED lamps directly onto thePCB substrate to make electric
Belight LED Display Information
Belight LED Display Information
Belight LED Display Information
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